BD151 anti wear abrasion chemical resistant epoxy compound ceramic tile bonding adhesives
Invention Patent No.:
200510064703.1 ( Patent Certificate for your reference )
Packing specification:
Two component,5Kg/group(A component: 4Kg, B component: 1Kg),packed in a plastic drum.
performance features:
It's consist of modified heat resistant toughening resin and special curing agent
Aging resistant(can reach more than 8 years),high temperature resistant,good toughness
Can cure at room temperature,can also heat for curing
When it is used as structural bonding,the highest working temperature is 150¡æ
product usage:
mainly used in the bonding of wear resistant ceramic chip on the top surface and facade of the equipment. With strong initial adhesion,it won't fall off without using magnet or other support measures during construction,optimizing construction technology and reducing construction cost
How to use:
1. Surface treatment:Grinding or sand blasting to clean up the dust,greasy dirt and rust on the surface of adherend,finally clean it by cleaning agent.
2. Configure adhesive: According to the specified requirements,make A and B two components mix uniformly,the mass ratio is A:B=4:1
3. Using adhesive:Make configured adhesive be coating on the adherend surface uniformly.
4. Curing:it's 0.5¡«1 hour for room temperature initial curing,and 24 hours for fully curing(8¡«10MPa),heat it up to the temperature of 80¡æ and keep this temperature for 2 hours,then do the post curing,can get higher strength(≥18MPa)
5. Every time the suitable configured adhesive quantity should not be too much,in order to avoid shorten the sizing time
6. The configured adhesive should be used up as short time as possible(before initial curing)
7. When the temperature is too low in the process of construction,should heat up the A component properly first for easy to configure adhesive and use adhesive.
performance index:
BD151 abrasion resistant ceramic chip adhesive physical mechanical properties table | |||||
color | physical state | density(g/cm3) |
compressive strength(Mpa) GB/7124-2008 |
shear strength(Mpa) GB/1041-2008 |
impact strength(J/cm2) GB6328-1999 |
black | paste | 1.45 | 104 | 25¡æ≥16MPa£¬150¡æ≥7.5MPa | 57 |
BD151 abrasion resistant ceramic chip adhesive curing features table(test condition:temperature:20¡«25¡æ,relative humidity:55) | |||||
coating time limit(min) | curing time | need curing time before full load operation | working temperature(¡æ) | the highest temperature resistant(¡æ) | |
30¡«60 | room temperature:24h or room temperature:1h+60¡æ:2h | 36h | -60¡«120 | 150 |
Special version:
1. This parameter is for laboratory conditions,due to the actual working condition is more complex,suggest users do pretest according to actual working condition
2. When the environment temperature is below 15¡æ,the curing time will prolong,should take proper heating measure
3. When the environment temperature is more than 25¡æ or the mixing quantity is too large,the curing speed will expedite,should properly shorten the application time of coating after mixing.
Transportation storage:
1.Sealed storage in the cool and dry place,the warranty period is 1 year.
2.Avoid placing it upside down,knocking against and transporting it as a non-dangerous product during transportation.
Product packaging photo of BD151 anti abrasion wear impact resistant ceramic tile bonding epoxy adhesive: